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RoHS High TG FR4 Multilayer Intersect Blind And Buried Via Pcb With High Quality

RoHS High TG FR4 Multilayer Intersect Blind And Buried Via Pcb With High Quality

Welcome to Well-Tech - one of the leading manufacturers and suppliers of PCB products in China. Our factory is engaged in PCB manufacturing and offering customized rohs high tg fr4 multilayer intersect blind and buried via pcb with high quality at competitive price. High reliability,...

Description

Welcome to Well-Tech - one of the leading manufacturers and suppliers of PCB products in China. Our factory is engaged in PCB manufacturing and offering customized rohs high tg fr4 multilayer intersect blind and buried via pcb with high quality at competitive price. High reliability, strong diversity and expert advice are our characteristics. Please contact us if you have inquiry.

Products description:

Blind and buried vias PCB: Blind holes are in inner layers and buried holes are in outer layers. Normall hole size is ≥0.2mm and using mechanical drilling. Blind and buried holes to increase wiring more freedom, wiring density increased so that the circuit becomes thinner and smaller, save material and resources.

Products specification:

Layers: 8

Material /Laminate: FR4 TG170

Board thickness: 1.2mm

Copper weight: inner & outer 1oz

Finishing: ENIG

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