• Follow us
Home > About Us > Process Capability
ItemUnitProcess Capability (sample)Process Capability (Production)
Surface Treatment/Tin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard GoldTin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard Gold
Selective Surface Treatment/ENIG+OSP,ENIG+Gold Finger,Gold Finger+HASL,Flash Gold+Gold Finger,Immersion Silver+Gold Finger,Immersion Tin+Gold FingerENIG+OSP,ENIG+Gold Finger,Gold Finger+HASL,Flash Gold+Gold Finger,Immersion Silver+Gold Finger,Immersion Tin+Gold Finger
Layer CountLayer0-30(≥26 Layers needs Review)0-12(≥10 Layers needs Review)
Bow and Twist%0.75(≤0.5needs Process Review)0.75(≤0.5needs Process Review)
Min finished sizemm10*10mmNeed panel
Max finished Size (≥4L)mm610*1200mm500*600mm
Multi-press for Blind/Buried Vias/Multi-press Cycle≤4 times(Needs review for 2 cycles pressing)Multi-press Cycle≤2times
Max finished Size (Double Sides)mm610*1500mm610*900mm
Finished Board Thicknessmm0.20-7.0(≤0.2mm Needs Review),≤0.4mm for HASL0.20-7.0(≤0.2mm Needs Review),≤0.4mm for HASL
Finished Board Thickness Tolerance(≤1.0mm)mm±0.1±0.1
Finished Board Thickness Tolerance(>1.0mm)mmMaterial Thickness±8%Material Thickness±10%
Unspecified Finished Board Thickness Tolerance(No stack up requirements)mmMultilayer:≤2.0mm can±0.1;2.0-3.0mm can±0.15;≥3.0mm can±0.2;Double Sides+/-10%Multilayer:≤2.0mm can±0.1;2.0-3.0mm can±0.15;≥3.0mm can±0.2;Double Sides+/-10%
Peel StrengthN/cm7.87.8
Flammability 94V-094V-0
Ionic Contaminationug/cm2≤1≤1
Min Dielectric Thicknessmm0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80%0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80%
Impedance Tolerance%±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%(Needs Review)±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%(Needs Review)
High Tg Material Shengyi Tg>170℃; ITEQ 180; KV6168Shengyi Tg>170℃; ITEQ 180; KV6168
Impedance Control MaterialOthers need ReviewFR-4,FR-4 HighTg SeriesFR-4,FR-4 HighTg Series
RCC MaterialNeeds ReviewCopper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um)Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um)
FR-4 Prepreg、LD-1080(HDI) 7628 2116 1080 3313 1067628 2116 1080 3313 106
Copper Foilum12、18、35、70、105、14012、18、35、70、105 (Use 70UM base copper,After plating 105UM)
Scrubbing Machine 0.11-3.2mm,min 9*9inch0.11-3.2mm,min 9*9inch
laminator, Exposer 0.11-6.0mm,min 8*8in,max 24*24in0.11-6.0mm,min 8*8in,max 24*24in
Etching Line 0.11-6.0mm,min 7*7inch0.2-6.0mm,min 7*7inch
Min Inner Line Width(18um copper foil,Before Compensation)mil3.24
Min Inner Line Spacing(18um base copper,after compensation)mil3.24
Min Inner Line Width(35um copper foil,Before Compensation)mil44
Min Inner Line Spacing(35um base copper,after compensation)mil44
Min Inner Line Width(70um copper foil,Before Compensation)mil67
Min Inner Line Spacing(70um base copper,after compensation)mil67
Min Inner Line Width(105um copper foil,Before Compensation)mil1010
Min Inner Line Spacing(105um base copper,after compensation)mil810
Min Inner Line Width(140um copper foil,Before Compensation)mil1214
Min Inner Line Spacing(140um base copper,after compensation)mil1014
Min Spacing from hole edge to conductivemil≤6L 6.5mil(Partial 7mil)、≤12L  10mil(Partial 9mil)≤6L 8mil(Partial 7mil)、≤12L  10mil(Partial 9mil)
Min Innerlayer Annular Ringmil3(18,35um,Partial3.5),6(70um),8(105um)5(18,35um,Partial3.5),7(70um),10(105um)
Min Innerlayer Isolation ClearancemilConductive to Conductive 10mil(Partial 8mil)Conductive to Conductive 12mil(Partial 8mil)
Min Spacing from board edge to conductivemil8(except for blind vias)、10(Blind Vias)10(except for blind vias)、12(Blind Vias)
Min Gap width between copper groundmil5(35um base copper) ≥2pcs (≥70um needs review) 8(35um base copper) ≥2pcs (≥70um needs review) 
Different copper thckness for inner coreum18/35,35/70(needs review)18/35,35/70(needs review)
Max Finished Copper Thicknessoz10OZ(175um)、≥6OZ needs review4OZ(140um)
Min Outer Line Width(6-9um base copper,before compensation)mil3(achieve copper Thickness25um-30um)3.2(achieve copper Thickness25um-30um)
Min Outer Line Spacing(6-9um base copper, after compensation)mil33.2
Min Outer Line Width(12um base copper,before compensation)mil3(achieve copper Thickness30um-35um)3.5(achieve copper Thickness30um-35um)
Min Outer Line Spacing(12um base copper, after compensation)mil33.5
Min Outer Line Width(18um base copper,before compensation)mil4.54.5
Min Outer Line Spacing(18um base copper, after compensation)mil3.54
Min Outer Line Width(35um base copper,before compensation)mil5.05.0
Min Outer Line Spacing(35um base copper, after compensation)mil45
Min Outer Line Width(70um base copper,before compensation)mil7.07.0
Min Outer Line Spacing(70um base copper, after compensation)mil4.06.0
Spacing from Line to pad, pad to pad (After compensation)mil3.5(12um),4.0(18um、35um),5.5(70um),6.5(105、140um)4(12um),4.0(18um、35um),5.5(70um),6.5(105、140um)
Min Outer Line Width(105um base copper,before compensation)mil9.012.0
Min Outer Line Spacing(105um base copper, after compensation)mil6.012.0
Min Outer Line Width(140um base copper,before compensation)mil12.016.0
Min Outer Line Spacing(140um base copper, after compensation)mil12.016.0
Min Grid Line Widthmil5(12、18、35 um),8(70 um)5(12、18、35 um),10(70 um)
Min Grid Spacingmil5(12、18、35 um),8(70 um)5(12、18、35 um),10(70 um)
Min Hole Pad Diametermil12(0.10mm mechanical or Laser Drill)12(0.10mm mechanical or Laser Drill)
Max size for slot tenting 5mm*3.0mm;the tent land should >10mil5mm*3.0mm;the tent land should >10mil
Max diameter for tenting holemm4.54.5
Min tent land widthmil66
Min annular ring(after compensation, except for blind vias)mil4(12、18um) Partial 3.5、4.5(35um)、          6(70um)、8(105um)、10(140um)4(12、18um) 、5(35um)、          6(70um)、8(105um)、10(140um)
Min BGA diamtermil10(Flash gold 8mil)10(Flash gold 8mil)
Orbotech SK-75  AOI/0.05-6.0mm,max 23.5*23.5inch0.05-6.0mm,max 23.5*23.5inch
Orbotech  Ves Machine/0.05-6.0mm,max 23.5*23.5inch0.05-6.0mm,max 23.5*23.5inch
Dis covery 8200 AOI/0.05-7.7mm,max26*31inch0.05-7.7mm,max26*31inch
NTL-DG2H\NTL-DG6H Drill machinecan process 2nd drill0.11-6.0mm,max size 22.4*26inch   min   Drill ¢0.15MM0.11-6.0mm,max size 22.4*26inch   min   Drill ¢0.15MM
MT-CNC2600 Drill machinecan process 2nd drill0.11-6.0mm,max size 18.5*26inch  min   Drill  ¢0.20MM0.11-6.0mm,max size 18.5*26inch  min   Drill  ¢0.20MM
Min slot drill bit sizemm0.50.5
Max aspect ratio for board thickness vs drill bit size/12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review)12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review)
Hole location tolerance(Compare with CAD data)mil±3±3
Counterbore hole PTH & NPTH,Top angle 130 Degree,Top diameter <6.3mmPTH & NPTH,Top angle 130 Degree,Top diameter <6.3mm
Min spacing from hole edge to conductive(Except for blind vias)mil6(≤8 L),7(≤10 L),8(≤14 L),12(≤26 L)6(≤8 L),7(≤10 L),8(≤14 L),12(≤26 L)
Max drill bit sizemm6.36.3
Max board thickness for 0.20mm drill bit sizemm2.52
Min multi-hit slot widthmm0.450.45
Hole size tolerance for press fitmil±2±2
Min PTH Slot dimension tolerancemm±0.15±0.15
Min NPTH slot dimension tolerancemm±0.05±0.05
Min spacing from hole edge to conductive(Blind vias)mil8(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing)8(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing)
Max board thickness for 0.15mm mechanical drillmm1.35(≤8 L) needs review1.2(≤8 L) needs review
Min hole size for laser drillmm0.10(Depth ≤55um),0.13(Depth ≤80um,0.15(Depth ≤100um)0.10(Depth ≤55um),0.13(Depth ≤80um,0.15(Depth ≤100um)
Countersink hole angle & Diameter Top 82,90,120 degree, diameter≤10mm needs reviewTop 82,90,120 degree, diameter≤10mm needs review
Panel & Pattern plating line 0.20-7.0mm,max 24*30inch0.20-7.0mm,max 24*30inch
Deburring Maching 0.20-7.0mm,min 8*8inch0.20-7.0mm,min 8*8inch
Desmear LineCan process 2nd desmear0.20-7.0mm,max 24*32in0.20-7.0mm,max 24*32in
Tin Plating Line 0.20-3.2mm,max 24*30inch0.20-3.2mm,max 24*30inch
Min hole wall copper thicknessumaverage 25,min≥20average 25,min≥20
Finished copper thickness(12um base copper)um≥25≥18
Finished copper thickness(18um base copper)um≥35(nominal thickness 52um、or 1.5Oz)≥35(nominal thickness 52um、or 1.5Oz)
Finished copper thickness(35um base copper)um≥50(nominal thickness 65um)≥50(nominal thickness 65um)
Finished copper thickness(70um base copper)um≥85≥85
Min Line width for ectching markingmil8(12、18um),10(35um),12(70um)8(12、18um),10(35um),12(70um)
Max finished copper thickness for inner & Outer layers/1OZ(350um)、≥6OZ needs review1OZ(350um)、≥6OZ needs review
Different copper thickness/18/35、35/70(needs review)18/35、35/70(needs review)
Scrubbing Machine/0.50-7.0mm,min:9*9inch0.50-7.0mm,min:9*9inch
Exposer/0.11-7.0mm,max 25*32inch0.11-7.0mm,max 25*32inch
Develop Machine/0.11-7.0mm,min 4*5inch0.11-7.0mm,min 4*5inch
Solder Mask Color/Green, yellow, black, blue, red, white, matte greenGreen, yellow, black, blue, red, white, matte green
silkscreen Color/White,yellow,black,orange,grayWhite,yellow,black,orange,gray
Min Solder Mask Opening(Clearance)(After Compensation)mil2mil(Partial 1.5 for Flash Gold,others can partia 1mil)Only for18um & 35um2mil(Partial 1.5 for Flash Gold,others can partia 1mil)Only for18um & 35um
Max plugged vias sizemm0.65mm for drill bit size0.5mm for drill bit size
Min width for line coverage by S/Mmil2mil per side,Only applies to 18um and 35um base copper2mil per side,Only applies to 18um and 35um base copper
Min solder mask legends widthmil8(min 7mil)8(min 7mil)
Min solder mask thicknessum88
Solder mask thickness for via tentingum1010
Min  carbon oil line spacingmil1010
Carbon oil/carbon oil min seclusionmil1414
Carbon oil cover line minmil2.52.5
Carbon oil min  line widthmil1212
Min Spacing from carbon pattern to padsmil10mil、70um base copper≥12mil10mil、70um base copper≥12mil
Min width for peelable mask cover line/padsmil66
Min solder mask bridge widthmilBase copper≤1OZ,Black,white & matte ink are 6mils, other inks are 4mils. Base coper 2-4OZ, min bridge width is 6mils.Base copper≤1OZ,Black,white & matte ink are 6mils, other inks are 4mils. Base coper 2-4OZ, min bridge width is 6mils.
Solder Mask HardnessH66
Min spacing from peelable mask pattern to padsmil1212
Max diameter for peelable mask tent hole (By screen printing)mm22
Max diameter for peelable mask tent hole (By Aluminum printing)mm4.54.5
Peelable mask thicknessmm0.2-0.50.2-0.5
Min Component mark line width and height(12、18um base copper)/Line width 4.5mil;Height:23milLine width 4.5mil;Height:23mil
Min Component mark line width and height(35um Base copper)/Line width 5mil;Height:27milLine width 5mil;Height:27mil
Min Component mark line width and height(≥70um Base copper)/Line width 6mil, height 45mil (State double printing on Lot Card)Line width 6mil, height 45mil (State double printing on Lot Card)
Min Spacing from legends to padsmil77
Max Gold Finger Lengthinch22
Nickel Thickness For ENIGum3-5UM3-5UM
Gold Thickness For ENIGum0.025-0.100.025-0.10
Nickel Thickness For Gold Fingerum3-5UM3-5UM
Gold Thickness For Gold Fingerum0.25-1.50.25-1.5
Min Tin Thickness For HASLum0.4(Copper Ground)0.4(Copper Ground)
HASL MachineCan process 2nd HASL0.6-4.0mm,min 5*5;max 20*25inch0.6-4.0mm,min 5*5;max 20*25inch
Gold Finger surface treatment Flash Gold/ENIG;Flash Gold/Hard GoldFlash Gold/ENIG;Flash Gold/Hard Gold
gold thickness of Water gold board  u"1-5(Conventionality>1u")1-5(Conventionality>1u")
nickel thickness of Water gold board u"120-250(Conventionality>120u")120-250(Conventionality>120u")
Immersion gold to OSP solder pad min distancemil9mil9mil
Immersion Gold 0.2-7.0mm,min 6*6in,max 21*27in0.2-7.0mm,min 6*6in,max 21*27in
Immersion Tin Thicknessum0.8-1.50.8-1.5
Immersion Silver Thicknessum0.1-0.3</td