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ENEPIG PCB For Bonding Contact Surface With High Stability

ENEPIG PCB For Bonding Contact Surface With High Stability

Welcome to Well-Tech - one of the leading manufacturers and suppliers of PCB products in China. Our factory is engaged in PCB manufacturing and offering customized enepig pcb for bonding contact surface with high stability at competitive price. High reliability, strong diversity and...

Description

Welcome to Well-Tech - one of the leading manufacturers and suppliers of PCB products in China. Our factory is engaged in PCB manufacturing and offering customized enepig pcb for bonding contact surface with high stability at competitive price. High reliability, strong diversity and expert advice are our characteristics. Please contact us if you have inquiry.

Products description:

ENEPIG (Immersion Ni/Au): ENEPIG is electroless deposition of NiPdAu. Palladium is harder than gold and good for heat diffusion, and also can effectively prevent the diffusion of black nickel and Ni. ENEPIG shows substantial advantages combining excellent shelf life, solder joint reliability, gold wire bondability and usage as a contact surface.

Products specification:

Layers: 2

Material /Laminate: FR4 TG150

Board thickness: 1.6mm

Copper weight: 1oz

Finishing: ENEPIG

The affect of surface treatment on soldering as below,

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