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Double Layer PCB Open Circuit Reasons And Improve The Method
Oct 20, 2017

Double Layer PCB line open, short circuit is the Double Layer PCB manufacturers almost every day encountered problems, has been plagued by the production, quality management personnel, which caused the lack of quantity due to shipments and feed, delays in delivery, customer complaints are the industry comparison Difficult to solve the problem. I have been in the Double Layer PCB manufacturing industry has more than 20 years of work experience, mainly engaged in production management, quality management, process management and cost control and other aspects of the work. For Double Layer PCB open and short circuit problems to improve the accumulation of some experience, is to form a text for the summary, for the Double Layer PCB manufacturers to discuss the discussion, and look forward to the management of production, quality counterparts can be used as a reference.

We will first cause the Double Layer PCB open the main reason summarized as the following aspects:

The causes of the above analysis and improvement methods are listed below:

First, open the substrate caused by open:

1, CCL into the library before there is a scratch phenomenon;

2, CCL in the open process was scratched;

3, CCL drill hole was drilled when drilling;

4, CCL in the transit process was scratched;

5, after the copper plate stacking plate due to improper operation caused by surface copper foil was bumped;

6, the production board in the horizontal machine when the surface of copper foil was scratched.

Improve methods: 

1, CCL IQC must be in the library before sampling, check whether there is a scratch on the substrate substrate phenomenon, if the timely contact with the supplier, according to the actual situation, to make appropriate treatment.

2, CCL in the process of opening the material was scratched, mainly due to the existence of hard material on the table there are hard objects, the opening of the CCL and artifacts friction caused by copper foil scratching the formation of the phenomenon of exposed substrate, so open Before the material must be carefully cleaned table to ensure that the table is smooth without hard objects exist.

3, CCL drill hole was drilled when drilling, the main reason is the spindle pinch was worn, or within the mouth of the debris is not clean clean, Double Layer PCB proofing grasping the drill when the grasping is not strong, the drill hole did not go to the top , Slightly longer than the set length of the drill, the height of the hole when drilling is not enough, the machine moves when the drill tip scratches the copper foil to form the exposed substrate.

a, can be recorded by grasping the number of times or according to the degree of wear of the mouth, the replacement of the mouth;

b, according to the operating procedures regularly clean the mouth Tsui, to ensure that there is no debris in the mouth.

4, the plate in the transit process was scratched:

a, handling personnel handling a one-time too much of the board, the weight is too large, the board is not lifted in the handling, but the opportunity to drag, resulting in plate angle and plate friction and scratch the board;

b, put down the board because there is no put neat, in order to re-organize and forced to push the board, resulting in friction between the plate and plate scratch plate.

5, Shen copper, the whole plate after plating plate due to improper operation was scratched:

After the copper, the whole board after plating plate, because the board stacked together, a certain number, the weight is not small, and then down, the corner down and add a gravity acceleration, the formation of a strong impact Impact on the board, causing the board to scratch the substrate.

6, the production board in the horizontal machine was scratched:

a, grinding machine baffle sometimes touch the surface of the board, the edge of the baffle is generally not smooth and favorable objects raised, the board when the board was scratched;

b, stainless steel drive shaft, due to damage into a sharp object, when the plate scratch the copper surface and exposed substrate.